We have steadily increased the number of wafers per centimeter of ingot through a combination of reduced thickness and lower kerf loss.
1、Since we started operations, the thickness of our wafers has been steadily reduced from 220μm to 200μm, significantly increasing wafer yield per ingot by around 10%.
2、Kinve's wafer cutting plant began operations in 2006 with the latest machinery from Japan.
+ WAFER THICKNESS
Name:NANJING KINVE SOLAR-POWER CO.,LTD ADD:NO2 XIANGFENG ROAD BINJIANG ECNOMIC ZONE NANJING CHINA
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